TC350 High-Thermal-Conductivity PCB with 2OZ Copper & ENIG Finish

1.Product Overview

Rogers TC350 is a high-performance PTFE-based laminate reinforced with thermally conductive ceramic fillers and woven glass. Designed for demanding RF power applications, this material combines excellent dielectric stability (Dk=3.5) with superior thermal management (0.72 W/mK). The 2-layer construction features heavy 2oz copper and ENIG finish, making it ideal for power amplifiers, tower-mounted equipment, and microwave combiners.

2.Key Material Properties

Stable Dielectric Constant: 3.5 from 1MHz to 10GHz
Ultra-Low Loss: 0.0015-0.002 dissipation factor (1MHz-10GHz)
Enhanced Thermal Performance: 0.72 W/mK conductivity
Temperature Stable: -9 ppm/°C ΔDk (-40°C to 140°C)
Moisture Resistant: 0.05% absorption
Exceptional Reliability: T260/T288/T300 >60 minutes

3.PCB Construction Details

4.PCB Stackup: 2-layer rigid PCB

70μm Copper (35μm base + plating)
1.524mm (60mil) TC350 Core
70μm Copper (35μm base + plating)

5.Board Statistics

Components: 23
Total Pads: 88
Thru Hole Pads: 72
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 34
Nets: 2

6.Manufacturing & Quality Standards

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping

7.Technical Advantages

Thermal Management: Reduces junction temperatures by 15-20%
Frequency Stability: <0.5% Dk variation across operating range
Manufacturing Ready: Compatible with standard FR-4 processes
Reliability: Excellent PTH integrity in thermal cycling

8.Target Applications

Power Amplifiers, Filters and Couplers
Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)
Thermally Cycled Antennas sensitive to dielectric drift
Microwave Combiner and Power Dividers